With over 25,000 square feet of manufacturing space, TES' manufacturing process is flexible and our personnel and infrastructure support both high volume and high mix manufacturing from single-card products to complex electromechanical assemblies.
Our printed circuit board (PCB) manufacturing capabilities feature:
- High end/reliable Universal HSP inline SMT systems that can handle BGA & QFN combined with Universal GSM machines that can place odd form and through hole components
- Pick & Place programming is done using customer provided CAD data and Gerber data for faster, more accurate assembly
- OmniFlo 7 Zone forced air convection reflow ovens
- Board sizes up to 20" x 20" and up to 36 layers
- 31K+ CPH (Components Per Hour) capable line
- Board flipper supports double sided boards without operator handling
- High mix/low volume and high volume/low mix capabilities
- Auto and semi-automatic paste deposition
- Rigid, flex and rigid/flex printed wiring board capability
- Board layout
- Design For Manufacturability (DFM) analysis/support
- Functional test (customer provided test stations)
- ROHS (lead free) and leaded solder processes
- LEAN MANUFACTURING and ISO QUALITY processes to maximize efficiency and quality
- Our facility utilizes "5 S" techniques for neatness and organization as a foundation for optimizing efficiency and quality